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Cleaning machine×ゼビオス（XEVIOS CORP.,） - List of Manufacturers, Suppliers, Companies and Products

Cleaning machine Product List

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Space-saving type "Spin Cleaning Device (Multipurpose Cleaning Type)"

Space-saving type "Spin Cleaning Device (Multipurpose Cleaning Type)"

One-chamber multipurpose scrub cleaning. It is possible to remove foreign substances and metal contamination in one chamber! Space-saving, making it suitable for research and development.

This is a single-chamber device that performs various sizes and types of wafers, including surfactants, pure water scrubbing, chemical spraying, megasonic spot showering, and spin drying. It is a space-saving model that allows for complete cleaning within a single cleaning layer, making it suitable for locations with limited space. Please consult us regarding single-function scrub cleaning devices. 【Features】 ■ Cleaning, rinsing, and drying can be done in one place ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, φ6” to φ8” *For more details, please contact us or download the catalog for more information.

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Wafer cleaning device "Double-sided scrub cleaning device (for research and development)"

Wafer cleaning device "Double-sided scrub cleaning device (for research and development)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the workpiece.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

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Single Chamber Type "Wafer Multi-Purpose Spin Scrub Cleaning Device"

Single Chamber Type "Wafer Multi-Purpose Spin Scrub Cleaning Device"

A space-saving cleaning device that removes foreign substances and metal contamination in a single chamber! It accommodates applications from mass production to research and development through a combination of cleaning methods.

A single-wafer device that performs the processes of surfactant and pure water scrub cleaning, chemical spraying, megasonic spot shower, and spin drying all in one chamber. ◇ Space-saving design that completes the process in a single chamber ◇ Compatible with various wafers including Si (silicon), LT (lithium tantalate), and SiC (silicon carbide) ◇ Removal of foreign substances (organic and inorganic) and metal ions ◇ Flexible response to changes in cleaning items and device configuration *For more details, please contact us or download the catalog to view.

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Box cleaning device

Box cleaning device

Cleaning difficult-to-wash uneven surfaces with high-pressure pulse jets! More stable cleaning results can be achieved compared to manual cleaning.

This is a cleaning device that performs the cleaning of various boxes using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling both the cleaning and drying processes. *For more details, please contact us or download the catalog to view it.*

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FOSB cleaning device

FOSB cleaning device

Cleaning difficult-to-clean uneven surfaces with high-pressure pulse jets! More stable cleaning results can be achieved compared to manual cleaning.

This is a cleaning device that performs cleaning of various FOSBs using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. *For more details, please contact us or download and view the catalog.*

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FOUP cleaning device

FOUP cleaning device

Cleaning difficult-to-wash uneven surfaces with high-pressure pulse jets! More stable cleaning results can be achieved compared to manual cleaning.

This is a cleaning device that performs cleaning of various boxes using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling the cleaning to drying process. 【Features】 ■ Cleaning tailored to complex shapes such as hoops ■ Automation of the cleaning process, ensuring stable cleaning effectiveness *For more details, please contact us or download the catalog to view.

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Precision parts cleaning device (degreasing)

Precision parts cleaning device (degreasing)

Degreasing cleaning device for HDD motor parts (HUB, case, etc.) Example configuration: detergent + ultrasonic (degreasing cleaning) → pure water rinse + ultrasonic → warm air drying → vacuum drying

This device is for degreasing and cleaning HDD motor components (HUB, case, etc.). Configuration: Detergent + Ultrasonic (degreasing) → Pure water rinse + Ultrasonic → Hot air drying → Vacuum drying. It will be manufactured according to the application.

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Wafer cleaning device "Double-sided brush cleaning device (mass production type)"

Wafer cleaning device "Double-sided brush cleaning device (mass production type)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the work.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing and cleaning is also performed. ■ Capable of simultaneous cleaning of both front and back sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download and view the catalog.

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Wafer cleaning device "Double-sided brush cleaning device (for research and development)"

Wafer cleaning device "Double-sided brush cleaning device (for research and development)"

It is possible to transport, wash, and dry without touching the front and back surfaces of the work.

A single-wafer device that performs polishing slurry cleaning with surfactants and pure water, rinsing with a megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog for review.

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Dual-side simultaneous scrub cleaning device for small diameter wafers (LT, SiC, etc. 2 to 6 inches)

Dual-side simultaneous scrub cleaning device for small diameter wafers (LT, SiC, etc. 2 to 6 inches)

A scrub cleaning device that allows for transportation and drying without touching the front and back of the workpiece! In addition to simultaneous cleaning of the front, back, and sides with a unique mechanism, it also supports combinations with ultrasonic showers and more.

A single-wafer device that performs polishing slurry scrubbing with surfactants and pure water, rinsing with megasonic spot shower, and spin drying. It allows for transport, cleaning, and drying without touching the front and back surfaces of the workpiece. Simultaneous edge scrubbing is also performed. ■ Capable of simultaneous cleaning of both sides ■ Target wafers for cleaning: silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ8”; thickness is negotiable ■ Also compatible with transparent wafers *For more details, please contact us or download the catalog to view.

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LT・SiC and other 2 to 6-inch small diameter wafer simultaneous chemical scrub cleaning device

LT・SiC and other 2 to 6-inch small diameter wafer simultaneous chemical scrub cleaning device

A chemical cleaning device that enables the removal of contaminants, metal pollution, and transport and drying without touching the front and back surfaces of the workpiece! It also supports a combination with brush cleaning using chemicals.

This is a single-wafer cleaning device that removes polishing slurry after polishing using disk scrub cleaning, and can perform chemical spraying, megasonic spot showering, and spin drying. It is capable of removing stubborn contaminants and metal contamination through chemical spraying, and can also accommodate simultaneous scrub cleaning of the edges as an option. ■ Simultaneous cleaning of both sides ■ Target wafers: Silicon, quartz, oxides, compounds, etc. ■ Compatible wafer diameters: φ2” to φ4”, thickness is negotiable ■ Compatible with transparent wafers *For more details, please contact us or download the catalog for more information.

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Cassette box cleaning device

Cassette box cleaning device

Cleaning difficult-to-clean uneven surfaces with high-pressure pulse jets! More stable cleaning results can be achieved compared to manual cleaning.

This is a cleaning device that performs cleaning of various carriers (cassettes) using high-pressure pulse jets while maintaining a constant distance from the items being cleaned with a multi-joint robot. It is capable of handling processes from cleaning to drying. *For more details, please contact us or download the catalog to view.

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300mm Cassette-less Cleaning System

300mm Cassette-less Cleaning System

Used in the chemical polishing process after final polishing / Batch processing of 50 pieces / Achieving high purity of 19nμm/5 pieces

<Equipment Overview> This device is used in the chemical polishing process after final polishing. Its feature is that it places 25 wafers in the gaps of 25 wafers, creating a half pitch, allowing for the simultaneous processing of 50 wafers. It achieves a high purity of 19nμm / 5 pieces.

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Si Nugget Cleaning Device

Si Nugget Cleaning Device

Si Nugget cleaning device with automatic transport using a dedicated basket, from chemical polishing, acid cutting, high-quality water washing to drying, improving cleaning efficiency through basket oscillation.

This device is designed for the cleaning of Si nuggets. The container containing the work (Si nuggets) is transferred to a dedicated cleaning basket within this device and is automatically transported to the cleaning facility. After that, the basket undergoes chemical polishing, acid etching, and high-quality water washing to clean the work. During this process, the cleaning basket is agitated to improve cleaning efficiency. After cleaning, it is moved to a dedicated drying basket and pre-dried with hot air at 150°C.

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1-chamber type liquid chemical spin scrub cleaning machine

1-chamber type liquid chemical spin scrub cleaning machine

Complete cleaning to spin drying in a single chamber. Space-saving design suitable for research and development as well as small lot production.

The "1-Chamber Type Liquid Spin Scrub Cleaning Machine" is a cleaning machine that allows for various combinations of non-contact cleaning methods such as high-pressure spray, ultrasonic spray, and chemical solutions, as well as contact cleaning methods like brushes. It completes the cleaning process and spin drying within a single chamber, contributing to space-saving design, which reduces installation space and costs. We can propose suitable equipment configurations based on various device configurations, chemical compositions, desired cleaning performance, and budget according to your needs. 【Features】 ■ Various cleaning methods and chemicals can be combined ■ Suitable for research and development applications and small to medium-sized sites ■ Ideal for sites developing and producing new materials such as SiC, GaN, and LT for small-diameter wafers and power semiconductors ■ Compatible wafer sizes: 3 inches to 6 inches (8 to 12 inches can be accommodated upon separate consultation) *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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